Temate Si-MWC Key Features

  1. Non-contact EMAT technique.
  2. Guided waves fill up the volume of the material and provide thru thickness inspection in one pass.
  3. Detects partial and full disbond, porosity, inclusions, poor planishing, and weld skips.
  4. Less sensitive to probe positioning, no “rastering” motion or “phased array” of sensors necessary.
  5. Self-calibrated sensor. No need for teaching period or regular calibrations.
  6. Permits inspection at up to 1m/s in completely automated environments.
  7. Exclusive flexible sensor technology that conforms to the surface and undulations of the part.
  8. Optional Process Monitoring hardware and software integrated with the weld inspection system.

Temate Si-MWC is designed for post-weld inspection of mash-seam (lap) welds in coil joining lines.

The system integrates seamlessly with automated welders used in galvanizing, annealing, and other finishing processes.

It uses Innerspec Technologies’ ultrasonic EMAT (Electro Magnetic Acoustic Transducer) technology, the most reliable non-destructive method for volumetric weld inspection at production speeds in demanding industrial environments.

In Mash Welding (RSEW-MS) two sheets with a small overlap are mashed together while current is being applied to make a solid state joint. The joint is immediately flattened (planished) after welding to form a flatter bond for easier rolling through the line.

Our proprietary system is a Non-Destructive Testing tool capable of detecting defects that affect the structural strength of the weld such as partial and full disbond, porosity, inclusions, poor or uneven overlap, poor planishing and weld skips.

 

An optional temate® Weld Process Control package adds instrumentation and data acquisition capabilities to automatically monitor, analyze and record welding parameters, controls and machine operations during the weld process.

The temate® Si-MWC installs on most automated welders and is endorsed and recommended by major manufacturers. It includes a complete self-diagnostics package.

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